000 | 02478cam a22003137a 4500 | ||
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001 | vtls000003263 | ||
003 | VRT | ||
005 | 20250102224919.0 | ||
008 | 081220s2005 enka f|b 101 0 eng | ||
020 | _a1852339411 (hbk.) | ||
024 | 3 | _a9781852339418 (hbk.) | |
039 | 9 |
_a201402040116 _bVLOAD _c201010091142 _dmalmash _c200812201347 _dNoora _y200812201343 _zNoora |
|
050 | 0 | 0 |
_aTK7874 _b.E75 2003 |
111 | 2 |
_aEuromat 2003 _d(2003 : _cLausanne, Switzerland) _949447 |
|
245 | 1 | 0 |
_aMaterials for information technology : _bdevices, interconnects and packaging / _cEhrenfried Zschech, Caroline Whelan and Thomas Mikolajick (eds.). |
260 |
_aLondon : _bSpringer, _cc2005. |
||
300 |
_axix, 508 p. : _bill. ; _c24 cm. |
||
440 | 0 |
_aEngineering materials and processes _949448 |
|
500 | _aSelected conference papers. | ||
504 | _aIncludes bibliographical references and index. | ||
505 | _aAdvanced materials characterization Thin film desposition Material aspects of non-volatile memories Materials for interconnects Materials for assembly/packaging | ||
520 | _aThe fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. This title includes: materials for silicon-based semiconductor devices (including high-k gate dielectric materials); materials for nonvolatile memories; materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and, materials for assembly and packaging. The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry. | ||
650 | 0 |
_aMicroelectronics _xMaterials _vCongresses. _949449 |
|
650 | 0 |
_aInformation technology _vCongresses. _949450 |
|
700 | 1 |
_aZschech, Ehrenfried. _949451 |
|
700 | 1 |
_aWhelan, Caroline. _949452 |
|
700 | 1 |
_aMikolajick, Thomas. _949453 |
|
942 |
_2lcc _n0 _cBK |
||
999 |
_c23434 _d23434 |