Materials for information technology : devices, interconnects and packaging / Ehrenfried Zschech, Caroline Whelan and Thomas Mikolajick (eds.).
Material type: TextSeries: Engineering materials and processesPublication details: London : Springer, c2005.Description: xix, 508 p. : ill. ; 24 cmISBN:- 1852339411 (hbk.)
- TK7874 .E75 2003
Item type | Current library | Call number | Copy number | Status | Barcode | |
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Books | Library First Floor | TK7874 .E75 2003 (Browse shelf(Opens below)) | 1 | Available | 11251 |
Selected conference papers.
Includes bibliographical references and index.
Advanced materials characterization Thin film desposition Material aspects of non-volatile memories Materials for interconnects Materials for assembly/packaging
The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. This title includes: materials for silicon-based semiconductor devices (including high-k gate dielectric materials); materials for nonvolatile memories; materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and, materials for assembly and packaging. The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.
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