TY  - BOOK
AU  - Zschech,Ehrenfried
AU  - Whelan,Caroline
AU  - Mikolajick,Thomas
ED  - Euromat 2003
TI  - Materials for information technology: devices, interconnects and packaging 
SN  - 1852339411 (hbk.)
AV  - TK7874 .E75 2003
PY  - 2005///
CY  - London
PB  - Springer
KW  - Microelectronics
KW  - Materials
KW  - Congresses
KW  - Information technology
N1  - Selected conference papers; Includes bibliographical references and index; Advanced materials characterization Thin film desposition Material aspects of non-volatile memories Materials for interconnects Materials for assembly/packaging
N2  - The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. This title includes: materials for silicon-based semiconductor devices (including high-k gate dielectric materials); materials for nonvolatile memories; materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and, materials for assembly and packaging. The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry
ER  -